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文章泉源 : 广东太阳GG检测 揭晓时间:2024-06-04 浏览数目:
AEC-Q200 是汽车电子委员会 (Automotive Electronics Council, AEC) 制订的标准,专门用于汽车电子元器件的可靠性测试,包括陶瓷电容器。为了确保陶瓷电容器切合AEC-Q200标准,需要举行一系列测试。这些测试旨在验证元器件在种种极端条件下的性能和可靠性。
太阳GG检测是具备AEC-Q200标准CNAS全项检测能力的第三方陶瓷电容器AEC-Q200认证测试机构,接下来为各人先容陶瓷电容器AEC-Q200认证测试项目及样品数目要求。

| Table 2: Stress Qualifications for Ceramic Capacitors 陶瓷电容器的应力条件 | |||||||||
| NO. 序号 | Stress 测试内容 | Reference 测试要领 | Minimum Sample Size Per Lot Depending on Component Size (cm3) | Number of lots 批次 | Accept on Number failed 允许缺乏格数 | ||||
| 样品体积 <10cm3 Sample Size Per 测试样品数目 | ≧10cm3 ≦330cm3 | >330cm3 | Individual 单个型号 | Family 系列 | |||||
| 1 | Pre- and Post-Stress Electrical Test 应力测试前后电气测试 | User Specification. 用户规范 | 除非尚有划定,所有认证器件 All qualification components unless otherwise specified | 0 Fails | |||||
| 2 | Temperature Cycling 温度循环 | JESD22-A104 | 77 | 26 | 10 | 1 | 3 | 0 Fails | |
| 3 | Destructive Physical Analysis 破损性物理剖析 | EIA-469 | 10 | 5 | 3 | 1 | 3 | 0 Fails | |
| 4 | Humidity Bias 高温高湿 | MIL-STD-202 Method 103 | 77 | 26 | 10 | 1 | 3 | 0 Fails | |
| 5 | High Temperature Operating Life 高温事情寿命 | MIL-STD-202 Method 108 | 77 | 26 | 10 | 1 | 3 | 0 Fails | |
| 6 | External Visual 外观检查 | MIL-STD-883 Method 2009 | 所有认证器件 All qualification parts submitted for testing | 0 Fails | |||||
| 7 | Physical Dimension 尺寸检查 | JESD22-B100 | 30 | 10 | 4 | 1 | 3 | 0 Fails | |
| 8 | Terminal Strength(THT) 端子强度 | MIL-STD-202 Method 211 | 30 | 10 | 4 | 1 | 3 | 0 Fails | |
| 9 | Resistance to Solvents 耐溶剂测试 | MIL-STD-202 Method 215 | 5 | 4 | 3 | 1 | 3 | 0 Fails | |
| 10 | Mechanical Shock 机械攻击 | MIL-STD-202 Method 213 | 30 | 4 | 3 | 1 | 3 | 0 Fails | |
| 11 | Vibration 振动 | MIL-STD-202 Method 204 | 30 | 4 | 3 | 1 | 3 | 0 Fails | |
| 12 | Resistance to Soldering Heat 耐焊接热 | MIL-STD-202 Method 210 | 30 | 4 | 3 | 1 | 3 | 0 Fails | |
| 13 | ESD ESD静电测试 | AEC-Q200-002 | 15 | 6 | 3 | 1 | 3 | 0 Fails | |
| 14 | Solderability 可焊性 | J-STD-002 | 15 each condition | 6 | 3 | 1 | 3 | 0 Fails | |
| 15 | Electrical Characterization 电气特征 | User Specification. | 30 | 10 | 4 | 3 | 3 | 0 Fails | |
| 16 | Board Flex (SMD) 板弯曲(贴片) | AEC-Q200-005 | 30 | 10 | 4 | 1 | 3 | 0 Fails | |
| 17 | Terminal Strength (SMD) 引出端强度(贴片) | AEC-Q200-006 | 30 | 10 | 4 | 1 | 3 | 0 Fails | |

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